No-clean flux residues detection with impedance measurements
Abstract – The no-clean flux-residues pose a high reliability risk, thus controlled strictly in the modern electronics assembly industry.
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Samples Anticatalytic Residue Resistance
PCBA surface insulation resistance (SIR) testing principle
Residues may cause the surface insulation resistance value of the test sample to be low. If residues are left on the circuit board, it will affect the reliability of the product in the application
“No-Clean” Flux Residues Detection With Impedance Measurements
From this perspective, we demonstrate a thorough examination of these more realistic structures with the classic dc SIR method and ac impedance measurements. This study examined
(PDF) Compatibility study of no-clean flux residue and conformal
The potential corrosion issues related to insufficient flux residues removal will be determined by the residue amount, its composition and ratio between organic components.
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Electrochemical Methods to Measure the Corrosion Potential of
Using the four activator packages studied in the SIR research, electrochemical methods will be run to determine the corrosion potential of the activators used within the four solder pastes.
Process Characterization that Results in Acceptable Levels of
The new protocols rely on more advanced methods of residue characterization, not only characterizing the chemical nature of the residue(s) but evaluating the impact of the residue on electrochemical
Electrochemical Methods to Measure the Corros ion Potential of
been commonly used for assessing corrosion potential on electronic devices. The purpose of this research study is to run Electrochemical Methods on the four flux systems used in the SIR study.
Surface Resistance Measurements
These examples show that surface insulation resistance (SIR) plays an important role in assessing the long-term reliability of an electronic assembly.